On March 11, the "Core Power, New Airport Economy" Xiamen Airport Economic Zone Semiconductor Industry Investment and Development Opportunity Sharing Session was successfully held in Shanghai. The event gathered over 150 participants, including industry leaders, experts, scholars, enterprise representatives, and investment institution delegates. Representatives from the Xiamen Municipal Investment Promotion Leading Group Office, the Xiamen Airport Economic Zone Command Headquarters, and Xiamen Torch Group jointly explored new development opportunities for the semiconductor industry within the zone.

　　Xiamen boasts a profound foundation in the semiconductor industry. Since its strategic layout began in the 1990s, the sector has continuously advanced, forming a complete industrial chain encompassing "materials - equipment - design - manufacturing - packaging & testing - terminal applications." It has attracted over 300 upstream and downstream enterprises, with its output value exceeding RMB 500 billion in 2025, ranking 13th nationally in comprehensive competitiveness. Policy support is precise and robust; Xiamen has introduced 13 comprehensive chain-supporting policies, offering enterprises up to RMB 30 million in annual fiscal support. The city pioneered an integrated circuit bonded supervision model, reducing customs clearance time by over 50%.

　　As Xiamen's new urban gateway, the Airport Economic Zone shoulders four major missions and has designated semiconductors as a key industry. It aims to strengthen this industrial highland through three-dimensional support in technology innovation, physical infrastructure, and capital. During the event, Torch Group presented plaques to its strategic partners, followed by expert sharing sessions that provided insights and recommendations for the zone's development.

According to reports, the event yielded fruitful outcomes. The Airport Economic Zone has engaged with 41 semiconductor enterprises expressing investment intent and is currently focusing on 15 key projects under negotiation. These projects cover areas such as chip design, materials, equipment, and packaging & testing.